Reduced Variation MOSFET Using a Drain-Extension-Last Process

ABSTRACT

A MOSFET structure and method of manufacture that minimize threshold variations associated with statistical uncertainties of implanted source and drain extensions. The source and drain extensions are fabricated very late in the process using a material added to etched recesses immediately adjacent to the transistor&#39;s channel. In various embodiments, the added material may be germanium grown by selective epitaxy, doped silicon grown by selective epitaxy, or metallic materials created by deposition or by deposition and reaction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.14/616,964 filed Feb. 9, 2015 which claims the benefit of U.S.Provisional Patent Application No. 61/940,026 filed Feb. 14, 2014, thecontent of which is included by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to the structure andmanufacturing of metal-oxide semiconductor field effect transistors(MOSFETs), and more particularly to MOSFETs manufactured forreproducibility of threshold voltages among otherwise identicaltransistors.

2. Prior Art

As dimensions of metal-oxide semiconductor (MOS) field effecttransistors (FETs) become smaller, they are more and more subject tovariations in their properties arising from the randomness of the exactpositions of dopants in and near the channel. Such variations,particularly random variations in threshold voltage (σV_(T)), aredevastating in circuits like low-power static random access memories.Random variations in threshold voltage increase both the minimum voltagerequired for reliable operation and the leakage current. Both effectshave an adverse effect on the power consumption at a given level ofperformance.

Random threshold variations σV_(T) are caused by some dominant factors:(i) random dopant fluctuations (RDF) in the well and in the pocketimplant regions underneath the gate, which, among other things, causevariations in depletion layer thickness; (ii) line edge roughness (LER)which causes random variation in the length of the gate electroderesulting from random variations in profile of the etched gate; and,(iii) metal gate granularity (MGG) which causes random variations in thelocal work function due to the grain structure of the gate material. Afourth source of variation is randomness in the effective channellength, arising from statistical variations in the position of thejunction that separates the channel from either the source or the drainextensions. This effect, which will be addressed below, has twoprincipal sources: a) variations in the final position of implanted ionsdue to scattering; and, b) variations in the activation and positions ofthe source/drain extension ions as influenced by the activation andsubsequent heat treatments. Randomness in channel length affects alltransistors, but some of the strategies used to mitigate random channeldoping fluctuations RDF actually exacerbate the randomness of thechannel length.

Drain extensions in modern transistors are required because the veryheavily doped sources and drains, if they were located immediatelyadjacent to the channel region, would out-diffuse into the channel andcause short circuits at the worst or very high leakage at the least. Thedrain extensions, even though fairly heavily doped for conductivity,allow the heaviest implants to be positioned some distance from thechannel.

FIGS. 1A through 1D show a typical approach to creating drain and sourceextensions. Figure lA shows a cross-section of a substrate with wellimplants 110, and that has a gate oxide 120 grown on it. Over the gateoxide there is a silicon gate 130, either polycrystalline or amorphous,and that gate has been oxidized to form an oxidation layer 140subsequent to patterning. At this stage, FIG. 1B, an ion implantation ora sequence of implantations 151 are used to create source and drainextensions 150.

FIG. 1C shows a spacer 160 that has been formed by chemical vapordeposition (CVD), with or without plasma assistance, of silicon nitridetypically. Through the use of anisotropic plasma etching, the depositedmaterial, e. g., nitride, is removed from all surfaces parallel to thesilicon wafer surface, but the spacer 160 remains on the sidewall. Thespacer protects the source and drain extensions 150 during the ionimplantation 171 that creates the very heavily doped source and drainregions 170. The ion implantation steps 151 and 171 must be followed byan annealing step to repair crystal damage and to activate the dopants.While at least one annealing step is required, some process flows annealmultiple times. In a complementary metal oxide semiconductor (CMOS)process, the implant steps 151 and 171 must be done for both n-channelmetal oxide semiconductor (NMOS) and p-channel metal oxide semiconductor(PMOS) devices. Rapid thermal annealing is the norm for implants 351 and371, but peak temperatures can exceed 1000° C. As suggested by FIG. 1D,the sheet resistance of the source and drain regions 170 is furtherreduced by reaction with metallic Ti, Co or Ni to form a highlyconductive layer of metal silicide 180. These steps are followed by theformation of interlayer dielectrics (ILD), contacts, and multiple layersof interconnect.

Even though the gate 130 and its oxide 140 act as a hard mask, the finallocations of the channel defining edges of the source and drainextensions 150 are subject to localized, random variations. Some ofthese variations are associated with scattering of the implanted ions asthey come to rest in the silicon, and some of the variations areassociated with local diffusion of both the doping ions and crystallinedefects during the annealing processes. The overall effect of theseuncertainties is to impose a random variation on the length of thechannel. For transistors having channel lengths of less than 65 nm, thechannel length affects both the threshold voltage and the currentcarrying capability of the transistors. Some of these effects aremitigated by adding pocket implants to the drain extension sequence 151,but the pocket implants are also subject to random variations.

Certain approaches to reducing the effect of random doping densityvariations involve the use of a very lightly doped epitaxial layerbeneath the gate. This class of transistor, which will be referred toherein as an epitaxial transistor, has been described variously in pastpublications including M. Aoki, et al., “0.1 mu m CMOS devices usinglow-impurity-channel transistors (LILT),” Electron Devices Meeting,1990. IEDM '90. Technical Digest., International, pp. 939, 941, 9-12Dec. 1990. More recent publications include Asenov et al. in the paper“Suppression of Random Dopant-Induced Threshold Voltage Fluctuations inSub-0.1-μm MOSFETs with Epitaxial and δ-Doped Channels,” IEEETransactions on Electron Devices, Vol. 46, No. 8, August 1999, Pages1718-1724, Fujita et al. in their paper “Advanced Channel EngineeringAchieving Aggressive Reduction of V_(T) Variation for Ultra-Low-PowerApplications”, Electron Devices Meeting (IEDM), 2011 IEEE International,pp. 32.3.1-32.3.4, 5-7 Dec. 2011, Clark, et al., “A Highly Integrated65-nm SoC Process with Enhanced Power/Performance of Digital and AnalogCircuits,”, Electron Devices Meeting (IEDM), 2012 IEEE International,pp. 14.4.1-14.4.4, 10-13 Dec. 2011, and U.S. Pat. No. 8,273,617 B2,“Electronic devices and systems,) and methods for making and using thesame,” by Thompson and Thummalapally (Sep. 25, 2012). The very lightlydoped channel regions are more subject to threshold perturbations by thetails of source/drain extension implants.

In view of the deficiencies of the prior art it would be advantageous toprovide a transistor structure and/or a manufacturing process thatreduces variations between otherwise identical transistors of anintegrated circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter that is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other objects, features, andadvantages of the invention will be apparent from the following detaileddescription taken in conjunction with the accompanying drawings.

FIG. 1A is a schematic cross-section of a MOSFET gate on gate oxide andsubstrate (prior art).

FIG. 1B is a schematic cross-section of a MOSFET gate with thesource/drain extension implant (prior art).

FIG. 1C is a schematic cross-section of a MOSFET gate with a spacer inplace and the heavy source/drain (N+ or P+) implant (prior art).

FIG. 1D is a schematic cross-section of a MOSFET gate with the sourceand drain finished with a metallic silicide layer to reduce source/drainparasitic resistance (prior art).

FIG. 2 is a schematic cross-section of a transistor realized inaccordance with an embodiment.

FIG. 3A is a schematic cross section of a gate defining step inrealizing a transistor in accordance with an embodiment.

FIG. 3B is a schematic cross section of a first spacer defining step inrealizing a transistor in accordance with an embodiment.

FIG. 3C is a schematic cross section of a heavily doped source and draindefining step in realizing a transistor in accordance with anembodiment.

FIG. 3D is a schematic cross section of a source/drain annealing step inrealizing a transistor in accordance with an embodiment.

FIG. 3E is a schematic cross section of a first spacer sacrificing stepin realizing a transistor in accordance with an embodiment.

FIG. 3F is a schematic cross section of a source drain extension recessdefining step in realizing a transistor in accordance with anembodiment.

FIG. 3G is a schematic cross section of a source drain extensiondefining step in realizing a transistor in accordance with anembodiment.

FIG. 3H is a schematic cross section of a source drain extension dopingstep in realizing a transistor in accordance with an embodiment.

FIG. 3I is a schematic cross section of a second spacer defining step inrealizing a transistor in accordance with an embodiment.

FIG. 3J is a schematic cross section of a source drain conductionenhancing step in realizing a transistor in accordance with anembodiment.

FIG. 3K is a schematic cross section of illustrating the addition ofinterlayer dielectric and contacts to the transistor of FIG. 3J.

FIG. 4 is a simplified flowchart showing the principal steps required torealize an embodiment.

FIG. 5 is a simplified flowchart showing the principal steps required torealize an alternative embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

It is important to note that the embodiments disclosed herein are onlyexamples of the many advantageous uses of the innovative teachingsherein. In general, statements made in the specification of the presentapplication do not necessarily limit any of the various claimedembodiments. Moreover, some statements may apply to some inventivefeatures but not to others. In general, unless otherwise indicated,singular elements may be in plural and vice versa with no loss ofgenerality. In the drawings, like numerals refer to like parts throughseveral views.

In order to minimize the impact of out-diffusion from the source anddrain extensions, embodiments move their formation to a very lateposition in the transistors' fabrication, and these extensions aredefined in a manner that exposes them for the least reasonable time athigh temperatures. The drain and source extensions are referred tocollectively because the embodiments describe a symmetrical structure inwhich the drain and source are not distinguished from one another. In anembodiment, the source and drain extensions are fabricated just prior tosource and drain silicidation, and they are fabricated from a highlyconductive material that is added to the underlying substrate. Contactto the active channel is assured by forming the highly conductivematerial in a slight recess adjacent to the active channel. One methodof realizing this structure is by using a first spacer to define theposition of the heavy source and drain implants, and then latersacrificing that spacer. An exemplary process sequence will be describedlater.

FIG. 2 shows an exemplary and non-limiting completed transistorstructure 200 according to an embodiment. Region 210 is that portion ofa transistor well in the immediate vicinity of the transistor's activechannel. This well may be formed by any of a number of processsequences. A conventional sequence of implants, phosphorus and/orarsenic for PMOS (p-channel, metal oxide semiconductor) transistors orboron, BF₂ ⁺ and/or indium for NMOS (n-channel, metal oxidesemiconductor) transistors will realize a standard well with thresholdsetting implants. A somewhat different sequence of implants wouldrealize a retrograde doping profile in the gate region. Less standardwells employ a thin epitaxial layer to realize superior mobility orthreshold fluctuation characteristics, as noted in the prior art above.All these structures are complementary to the drain extension structuredescribed herein. Region 220 is the gate oxide, which may be standardSiO₂, nitrided SiO₂ or any of a number of high-K dielectrics. Region 230is the gate per se, typically formed from polycrystalline or amorphoussilicon, doped to achieve relatively high conductivity. When anappropriate voltage is applied to the gate 230, a channel is inducedimmediately below the gate oxide 220. Region 225 is a non-criticalresidue of the initial protective oxide. Regions 250 are highlyconductive source and drain extensions. These extensions are positionedin shallow recesses located between the channel region and the heavysource/drain implants 270, typically overlapping a portion of thesource/drain implant. It is the role of the source and drain extensions250 to effect a low resistance connection between the heavy implants 270and the gate-controlled channel induced beneath the gate oxide 220.Various embodiments of this invention may utilize epitaxial siliconwithin the recesses, or epitaxial germanium, which may provide higherconductivity. An embodiment employs silicon grown epitaxially andincorporating high densities of doping elements during the growthprocess to form source and drain extensions 250. The extensions 250could even be formed from metals or metallic compounds as long as theirwork functions are selected to avoid the existence of Schottky barriersbetween the drain extensions and their associated conductive channels.

Spacers 260 are typically formed of silicon nitride. In an embodiment,these spacers are mainly important for defining the extent of theconduction enhancing silicide 280. The position of the heavysource/drain implants 270 relative to the gate structure 230 wasestablished by spacers that were sacrificed as part of the overallprocess sequence. That will become clear in the processing sequencedescribed below, but those spacers do not appear in the completedtransistor structure 200. Their position may or may not coincide withthe edges of the spacers 260.

The structure of FIG. 2 is also valid for a transistor in which the gatedielectric 220 is a high-K dielectric or the gate 230 includes a layerof metal or a metallic compound adjacent to a high-K layer 220.

The transistor structure 200 in FIG. 2 is incorporated in an integratedcircuit by covering it with an interlayer dielectric (ILD), etchingcontact holes to provide access to the conduction-enhancing silicides280 associated with the source, gate and drain of the transistor. Thesesteps, which usually use various dielectric depositions,photolithographic definition of contact holes, CVD (chemical vapordeposition) tungsten deposition and chemical mechanical polishing, arewell known in the industry, and they lie outside the scope of thisinvention.

FIGS. 3A through 3K show schematic cross sections of an embodiment asthe transistor evolves through a sequence of processing steps. FIG. 3Ashows a well 310, which may be a conventional well, a steeply retrogradewell or well incorporating an epitaxial layer adjacent the gate oxide.Positioned over that well is a gate oxide 320, which may be pure SiO₂,nitrided SiO₂, or a high-K dielectric. The gate 330 is located above thegate dielectric 320. The gate has been formed by a sequence of stepsthat include the deposition of amorphous or polycrystalline silicon,defining a pattern by photolithography, and etching the depositedmaterial to form a pattern of polysilicon interconnect and gates havingwidths ranging from 14 nm upward to 65 nm and beyond. Subsequent to itspatterning, the gate region 330 is oxidized to form a protective film340 on its sides. In prior art processes, drain extension implants wouldbe performed at this stage in the process flow. No drain extensionimplants are performed at this stage in this process, although pocketimplants may be executed at this stage, depending upon the transistordesign.

FIG. 3B illustrates a first spacer. This sacrificial spacer 365 is theconsequence of a sequence of processing steps that include depositingsilicon nitride by CVD or plasma enhanced chemical vapor deposition(PECVD) to a controlled thickness, then using an anisotropic plasmaetching process to clear the silicon nitride from the surfacesparalleling the plane of the wafer, but leaving a sacrificial spacer 365on the vertical surfaces. The width of the spacer 365 is largelydetermined by the thickness of the original deposition. While othermaterials may be used for the spacer, silicon nitride is a naturalchoice because it can be etched selectively with respect to SiO₂.

FIG. 3C shows the formation of the highly doped source and drain regions370 by ion implantation 371, using the sacrificial spacers 365 as a hardmask that defines the N+ or P+ 370 position relative to the gate 330.This implant is normally phosphorus and/or arsenic for NMOS transistorsand one or more of boron, BF₂ ⁺ and indium for PMOS transistors. Thisimplant also enhances the conductivity of the gate 330 and sets its workfunction advantageously for creating enhancement mode transistors if thegate is silicon-based, not metallic.

FIG. 3D shows the consequence of annealing the implants 370 in anoxidizing environment. An oxidizing environment is recommended so thatthe protective oxide 325 is thickened over the regions not shielded fromoxidation by the sacrificial spacers 365.

FIG. 3E illustrates the state after the spacers 365 have been removed byusing an etch that selectively attacks the spacer material withoutsignificantly attacking the underlying oxide 325. In the typical case,the spacer material is silicon nitride and hot phosphoric acid is atypical etchant. After the spacers are removed, a controlled, possiblyanisotripic, oxide etch is used to clear the thinner oxide that wasshielded by the spacers, leaving a protective layer 325 covering most ofthe source/drain regions 370 but leaving a small portion thereofexposed. The gate sidewall oxide 340 should be retained in this step.

FIG. 3F shows the result of using a silicon etch to create a recess 355in the space between the gate oxide 320 and the implanted sources anddrains 370. This recess is typically 10 nm deep, although it could beanywhere in the range of 5 nm to 20 nm deep. The silicon etch has to beselective with respect to SiO₂, but it could be either a reactive ionetch or a wet etch employing a strong base like tetramethylammoniumhydroxide or potassium hydroxide.

FIG. 3G shows a fabrication of source and drain extensions 350 in therecesses (355 in FIG. 3F). These extensions provide an efficient contactbetween the source/drain implants 370 and the MOSFET channel, which willbe induced immediately beneath the gate oxide 320 when an appropriatevoltage is applied to the gate 330. In an embodiment, extensions 350 aremanufactured by growing germanium by selective epitaxy in the recesses.Other materials may be appropriately used, including epitaxial silicon,epitaxial Si:Ge, epitaxial Si:C, metals, metallic compounds and metalsilicides. If the drain extension material is not a semiconductor likeSi, Ge or their alloys, then special attention is required to select amaterial so it has no significant barrier with respect to the channel orto the source/drain implants 370. If the drain extensions 350 aresemiconductor materials, doping those materials in situ is apossibility. This requires two separate epitaxial steps, and an exampleof that class of flow is shown in the alternate embodiment presented inFIG. 5. Since the intention is to minimize random variations in channellength associated with the diffusion or migration of impurities, it isimportant that this step and all subsequent steps be performed at lowtemperatures. Temperatures in excess of 900° C. are to be avoided, andlower temperatures not in excess of 800° C. or 650° C. are preferred.

FIG. 3H shows the use of ion implantation 351 to realize a highconductivity in the germanium source and drain extensions 350. Forcomplementary metal oxide semiconductor processes (CMOS) processes,separate implantations are required for the NMOS and PMOS transistors.For NMOS transistors, phosphorus and arsenic are the most appropriatedopants, and for PMOS transistors, boron BF₂ ⁺ and indium areappropriate. Gallium is also a less commonly used dopant, but it is alsoappropriate for PMOS source/drain extensions. After implantation, anactivation anneal may be required. That anneal may be as cool as 600° C.It should be noted that the processing associated with creating a highlyconductive silicide, as illustrated in FIG. 3J, may involve heat cyclessufficient to activate an implant described in this step. If the sourceand drain extensions 350 are metallic, implantation 351 and annealingare not required. Alternatively, if the source and drain extensions 350have been prepared by in-situ doping during an epitaxial depositionprocess, no annealing is required.

After the extensions 350 have been completed, a new spacer 360 is formedas shown in FIG. 3I. As before, the spacer is typically formed bydepositing CVD or PECVD silicon nitride to a thickness approximating thetarget width of the spacer. Then anisotropic reactive ion etching isused to clear the silicon nitride from the surfaces parallel to theplane of the substrate while leaving the nitride on the sidewalls. Theprincipal role of the spacer 360 is to confine a subsequently formedsilicide layer to the surfaces to be contacted. If the nitride layer isdeposited by CVD without plasma enhancement, the temperature will behigh enough to activate the implant in step 3H. Plasma enhanced CVD maybe preferable in order to avoid the higher temperature; it is importantto strictly limit the diffusion of dopants from the extensions 350 intothe substrate 310 regions immediately beneath the gate 320. The limiteddiffusion that will naturally occur will improve the junction quality.After the spacer is formed, the unprotected portions of the surfaceoxide 325 should be removed.

FIG. 3J shows the completion of a transistor sources and drains byforming a layer 380 of titanium silicide, cobalt silicide or nickelsilicide. This layer 380 serves both to enhance the sheet conductivityof the source and drain regions 370 and to provide a superior contactcapability to the interconnect structures. Silicide formation normallyincorporates two rapid thermal annealing steps, and these steps may alsobe sufficient to activate the implants 351 illustrated in FIG. 3H,making a separate anneal unnecessary. FIGS. 3I and 3J show the spacer360 broader in extent than the source drain extensions 350, leavingsmall residues 325 of protective oxide. This means that the final spacer360 is broader in extent than first, sacrificial spacer (365 in FIG.3B). This is not strictly necessary, since germanium reacts withtitanium, cobalt and nickel to form conductive metal-germanides, just asthose metals form conductive silicides.

It may be noted that selective epitaxial growth of Si, Si:Ge, Si:C or Gecan be controlled so there is no growth on the titanium silicide, cobaltsilicide or nickel silicide surfaces 380. That presents an opportunityto have a process flow in which the heavily doped sources and drains maybe silicided prior to sacrificing the spacer 365. The source and drainextension recesses 355 can then be formed after sacrificing the spacer365, provided a silicon etch is chosen for its inability to etch themetal silicide surfaces 380. This sequence offers the advantage offorming the source and drain extensions 350 after the high temperaturesilicidation process.

FIG. 3J shows a completed transistor, but it must be integrated withother transistors and interconnections to form a useful integratedcircuit. These steps, well known in the art, are suggested by FIG. 3K.The next step, as in all contemporary integrated circuits, is to depositone or more layers of ILD (interlayer dielectric) 390 and planarize thesurface. Note that, at this stage, it is possible to form a gate-last,high-K/metal gate structure by selectively etching the polycrystallineor amorphous gate material 330 and the underlying gate oxide 320, thenreplacing those materials with a high-K gate dielectric in the position320 and a metal gate in position 330. The ILD structure in the gate-lastcase is completed by chemical-mechanical polishing and a furtherdielectric deposition. Such implementation of a gate-last process iswithin the scope of the disclosure herein.

Transistors formed in accordance with these principles with or withoutgate last structures are further integrated into complex integratedcircuits by etching contact holes 395 in the planarized ILD 390 to reachthe regions 380 on the sources, gates and drains, and forming contactsthat include CVD tungsten filling the holes 395. Interconnection withmultiple layers of dielectric and metal completes the integratedcircuits. When the transistors described herein are integrated withtransistors employing more conventional fabrication, the overall processsequence must be planned to limit the thermal exposure after the sourceand drain extensions 350 have been implanted or deposited. In general,this means that the steps of etching recesses 355 and depositing theextensions 350 must be done after the high temperature steps in othertransistors have been completed.

FIG. 4 is a simplified Flow Chart 400 showing one example of theprincipal steps required to realize the transistor shown in FIGS. 2 and3. In this discussion, the particular elements in FIGS. 3A through 3Jwill be cited for clarification. Steps which are well known in theindustry, particular to specific manufacturers and complementary to thereplacement drain extensions described here are described very briefly.Steps 402, 404, 406, 408, 410, 412, 414 and 416 are found in most priorart processes. This includes the formation of a spacer 265 in steps 414and 416, except in this process flow, that spacer is eventuallysacrificed. Steps 418 and 420 arrange for heavy implantation 371 ofdonors to be directed into the sources and drains 370 of NMOStransistors, and for heavy implantation 371 of acceptors to be directedinto the sources and drains 370 of PMOS transistors.

Step 422 cites the use of an oxidizing environment during the source anddrain anneal in order to thicken the protective oxide 325 except whereit is covered by spacers. Step 424 describes removing the sacrificialspacers 365, using an etch that selectively removes silicon nitridewithout attacking the protective oxide 325. Step 426 is an oxide etchthat clears the protective oxide 325 where it is thin, having beenshielded by the sacrificial spacer 365. This etch is controlled so thatthe protective oxide 325 continues to cover the underlying silicon whereit was not shielded by the sacrificial spacer 365. In the areas wherethe silicon is exposed, i.e., adjacent to the gates, step 428 describesetching a recess 355 in the silicon, nominally 10 nm deep, but generallyin the range of 5 nm to 20 nm deep. In the next step 430, undopedepitaxial germanium is grown in the recesses 355 in order to form thesource and drain extensions 350. The thickness of the epitaxial layer350 has to be sufficient to fill the recesses 355, and it should beapproximately 10 nm thicker.

In order to provide high conductivity, the source and drain extensions350 must be doped with donors for NMOS transistors and acceptors forPMOS transistors. The masking steps 432 must be used to direct thecorrect implants 351 (see FIG. 3H) to the correct transistors. Theimplants 351 are indicated by step 434. Step 436 provides for activationof the implants from step 434.

Step 438 describes the commencement of forming a final spacer 360. Thesequence of nitride deposition in step 438 and anisotropic etching instep 440 is common in the industry. Subsequent to forming the permanentspacer 360, any remaining protective oxide 325 must be cleared, and thesilicide-forming metal is sputtered to a controlled thickness in step442. Well known processes employ a combination of a reacting metal and acovering film that protects the metal from atmospheric reaction prior toits heat treatment, step 444. The use of a silicide 380 to enhance theconductivity of source and drain diffusions 370 is standard practice inthe industry. Further, the heat treatments associated with silicideformation may be adequate to activate the implants 351 cited in step434. That is why step 436 is described as optional. It should be notedthat some process flows use an epitaxial layer either in lieu of or inaddition to the silicide layer 380. Either choice is complementary tothis embodiment.

Steps 446, 448, 450, 452, 454 and 456 are standard steps in contemporaryintegrated circuit processing, and they are complementary to thisembodiment.

An alternative embodiment of this same structure can be realized bytaking advantage of the capability of molecular beam epitaxy (MBE) tocreate thin, highly doped layers of silicon or silicon/germanium alloy.In this case, the source and drain extensions 250 in FIG. 2 are realizedas thin, epitaxial layers of highly doped silicon or silicon/germanium.The flow chart in FIG. 4 showed a single step 430 of epitaxial growth.In this embodiment, two separate epitaxial steps are required, heavilydoped n-type for NMOS transistors and heavily doped p-type for PMOStransistors. This distinction is made clear in the exemplary Flow Chart500 in FIG. 5.

Steps 502 through 522 in FIG. 5 duplicate steps 402 through 422 in FIG.4. Since separate epitaxial depositions 350 are required, step 524 usesphotolithography to expose the NMOS transistor areas while covering thePMOS transistor areas. Step 526 indicates that the sacrificial spacer365 is selectively removed from the NMOS transistors, and step 528 baresthe silicon that had been beneath the sacrificial gate 365. Step 530 isan etch that creates a recess 355 in the bare silicon adjacent to thegate 330. This recess has a nominal depth of 10 nm. In step 532 a layerof heavily doped silicon 350 is grown in the recess 355, filling thatrecess and extending 5 to 20 nm above the recess. An exemplary layerwill be grown by MBE, utilizing arsenic as a dopant at a concentrationbetween 1×10¹⁹ ions/cm³ and 1×10²¹ ions/cm³. In order to facilitatefurther processing, step 534 is the deposition of a thin protectivelayer of silicon nitride.

In order the process the PMOS transistors, lithography step 536 exposesthe PMOS transistors while protecting the NMOS transistors. Step 538removes the sacrificial spacers 365 from the PMOS transistors as well asthe protective nitride from step 534. In steps 540 and 542, theprotective oxide 325 adjacent to the PMOS gate 330 is removed, and baresilicon is etched to create a recess nominally 10 nm deep. Step 544forms PMOS source and drain extensions 350 using MBE employing boron asa p-type dopant, and the boron concentration should be in the range of1×10¹⁹ ions/cm³ and 1×10²¹ ions/cm³. The thickness of the boron dopedepi layer 350 should be sufficient at least to fill the recess 355, andit is preferably 5 nm to 20 nm thicker.

The steps 546 through 564 in Flow Chart 500 are identical to steps 438through 456 in Flow Chart 400.

Transistors formed in accordance with these principles with or withoutgate last structures are further integrated into complex integratedcircuits by etching contact holes in the planarized ILD to reach theregions 380 on the sources, gates and drains, and forming contacts thatinclude CVD tungsten. Interconnect with multiple layers of dielectricand metal completes the integrated circuits. When these transistors areintegrated with transistors employing more conventional fabrication, theoverall process sequence must be planned to limit the thermal exposureafter the source and drain extensions 350 have been implanted. Ingeneral, this means that the steps of etching recesses 355 anddepositing the extensions 350 must be done after the high temperaturesteps in other transistors have been completed.

While the descriptions above have used an example of bulk siliconsubstrates, the same basic processing steps may be used forsilicon-on-insulator transistors. Where the processing incorporatesepitaxial growth, that growth will be dominated by the single crystalsurfaces available after the recess is etched, but the resultingstructure will offer the same advantages in terms of reduced variationsin channel length.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the principlesof the invention and the concepts contributed by the inventor tofurthering the art, and are to be construed as being without limitationto such specifically recited examples and conditions. Moreover, allstatements herein reciting principles, aspects, and embodiments of theinvention, as well as specific examples thereof, are intended toencompass both structural and functional equivalents thereof.Additionally, it is intended that such equivalents include bothcurrently known equivalents as well as equivalents developed in thefuture, i.e., any elements developed that perform the same function,regardless of structure.

The invention disclosed herein describes a transistor structure havingsource and drain extensions that are specifically fabricated to minimizethe random variations in channel length associated with implanted anddiffused source and drain extensions. A person of ordinaryskill-in-the-art would readily understand that the invention can beadapted for use in a plurality of ways, including integrated circuitswhere all transistors or a portion thereof are manufactured using thetechniques disclosed hereinabove. Furthermore, although the invention isdescribed herein with reference to the preferred embodiments, oneskilled-in-the-art will readily appreciate that other applications maybe substituted for those set forth herein without departing from thespirit and scope of the present invention. Accordingly, the inventionshould only be limited by the Claims included below.

What is claimed is:
 1. A method of forming a metal-oxide semiconductor (MOS) transistor comprising: forming sidewall spacers on two opposite sides of a gate of the MOS transistor, the sidewall spacers formed over an oxide layer; implanting and annealing a source implant and drain implant of the MOS transistor; enhancing the oxide layer thickness over the source implant and drain implant; sacrificing the sidewall spacers; clearing the oxide layer exposed after the sacrificing of the sidewall spacers; creating a first recess where the oxide layer has been cleared on the heavy source implant side; creating a second recess where the oxide layer has been cleared on the heavy drain implant side; filling the first recess with a conductive material; and filling the second recess with the conductive material.
 2. The method of claim 1, wherein the first recess extends from partially within the source implant to a transistor channel extending under the gate.
 3. The method of claim 1, wherein the second recess extends from partially within the drain implant to a transistor channel extending under the gate.
 4. The method of claim 1, wherein the conductive material filling any one of the first recess and the second recess is an epitaxial material consisting of any one of: epitaxial silicon, epitaxial silicon:germanium, epitaxial germanium or epitaxial silicon:carbon.
 5. The method of claim 1, wherein filling the first recess and/or the second recess with the conductive material comprises: depositing an epitaxial material.
 6. The method of claim 5, further comprising: processing at least an interface between a channel of the transistor formed under at least the gate and the conductive material in the first recesses and the conductive material in the second recess to be free of variations associated with thermally induced diffusion or migration.
 7. The method of claim 5, wherein depositing the epitaxial material further comprises: incorporating either n-type dopants (donors) or p-type dopants (acceptors) during the epitaxial deposition process.
 8. The method of claim 5, wherein depositing the epitaxial material further comprises: implanting either n-type dopants (donors) or p-type dopants (acceptors) subsequent to the epitaxial deposition process.
 9. The method of claim 8, wherein activation of the implanted dopants further comprises a dedicated annealing step.
 10. The method of claim 8, wherein activation of the implanted dopants further comprises an annealing step associated with metal silicide processing.
 11. The method of claim 1, wherein the conductive filling material is any one of: a metal or a metallic compound.
 12. A method of forming a metal-oxide semiconductor (MOS) transistor formed on a semiconductor substrate, the method comprising: forming a source extension connecting a source of the metal-oxide semiconductor to a channel under a gate structure of the metal oxide semiconductor by selectively depositing and filling a first recess formed in the semiconductor substrate between the source and the gate structure and forming a drain extension connecting a drain of the metal-oxide semiconductor to the channel under a gate structure of the metal oxide semiconductor by selectively depositing and filling a second recess formed between the drain and the gate structure, using a conductive material, where in the selectively depositing of the conductive material is done at a temperature not exceeding 650 degrees Celsius.
 13. The method of claim 12, wherein the conductive material is a semiconducting material.
 14. The method of claim 12 wherein the selective deposition of conductive material is done by selective epitaxial deposition.
 15. The method of claim 14, wherein the material deposited by selective epitaxy is any of: epitaxial silicon, epitaxial silicon:germanium, epitaxial germanium or epitaxial silicon:carbon.
 16. The method of claim 12, wherein the semiconductor substrate is any one of: a silicon substrate or a silicon-on-insulator (SOI) substrate.
 17. The method of claim 12, wherein the use of temperatures not exceeding 650 degrees Celsius reduce diffusion of dopants into the semiconductor substrate and under the gate of the MOS transistor.
 18. A method of forming a metal-oxide semiconductor (MOS) transistor formed on a semiconductor substrate, the method comprising: forming a source extension connecting a source of the metal-oxide semiconductor to a channel under a gate structure of the metal oxide semiconductor by selectively depositing and filling a first recess formed in the semiconductor substrate between the source region and the gate structure, and forming a drain extension connecting a drain of the metal-oxide semiconductor to the channel under a gate structure of the metal oxide semiconductor by selectively depositing and filling a second recess formed between the drain region and the gate structure, using an undoped epitaxial material and doping the undoped epitaxial material to a conductive state by an implantation of selected dopant types, followed by an anneal, where in the selectively depositing of the epitaxial material and annealing of the epitaxial material is done at a temperature not exceeding 650 degrees Celsius.
 19. The method of claim 18, wherein the selected dopant type is P-type for a P-channel MOS transistor and the selected dopant is N-type for an N-channel MOS transistor.
 20. The method of claim 18, wherein the use of temperatures not exceeding 650 degrees Celsius reduce diffusion of dopants into the semiconductor substrate and under the gate of the MOS transistor.
 21. A method of forming a metal-oxide semiconductor (MOS) transistor comprising: forming sidewall spacers on two opposite sides of a gate of the MOS transistor, the sidewall spacers formed over an oxide layer; implanting and annealing a source implant and a drain implant of the MOS transistor; sacrificing the sidewall spacers; clearing the oxide layer exposed after the sacrificing of the sidewall spacers; creating a first recess where the oxide layer has been cleared and extending away from the gate into the source implant; creating a second recess where the oxide layer has been cleared and extending away from the gate into the drain implant; filling the first recess with a conductive material; and filling the second recess with the conductive material.
 22. The method of claim 21 wherein the annealing the source and drain implants is performed in an oxidizing environment to enhance the oxide layer thickness over the source implant and drain implants. 